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LNP THERMOCOMP Compound LC006EX1
PEEK
沙伯基础(SABIC)
产品描述
LNP THERMOCOMP LC006EX1 compound is based on Polyetheretherketone (PEEK) resin containing 30% post-industrial-recycled (PIR) carbon fiber. Added features of this grade include High Modulus, High impact, Easy Molding and Electrically Conductive.
产品特性：高冲击，导电，易成型，填充增强
成型方式：注塑
增强填充：30% 碳纤维
香港鸿润创业国际有限公司,专注塑料20多年,原厂标准包装,PEEK年销2000吨,库存充足,品质保障,交货快捷!
欢迎来电咨询: 18816996168 (代先生),13538586433 (邓小姐)
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