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Content
LNP THERMOCOMP Compound LC006EXQ
PEEK
沙伯基础(SABIC)
产品描述
LNP THERMOCOMP LC006EXQ compound is based on Polyetheretherketone (PEEK) resin containing 30% carbon fiber. Added features of this grade include: Electrically Conductive, Easy Molding.
产品特性：导电，易脱模，填充增强
增强填充：30% 碳纤维
香港鸿润创业国际有限公司,专注塑料20多年,原厂标准包装,PEEK年销2000吨,库存充足,品质保障,交货快捷!
欢迎来电咨询: 18816996168 (代先生),13538586433 (邓小姐)
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