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Content
LNP THERMOCOMP Compound LFW55EX1
PEEK
沙伯基础(SABIC)
产品描述
LNP THERMOCOMP LFW55EX1 compound is based on Polyetheretherketone (PEEK) resin containing 25% glass fiber and 25% mineral. Added features of this material include: Easy Molding, Dimensional Stability.
产品特性：易成型、尺寸稳定性
增强填充：25%玻纤+25%矿物
香港鸿润创业国际有限公司,专注塑料20多年,原厂标准包装,PEEK年销2000吨,库存充足,品质保障,交货快捷!
欢迎来电咨询: 18816996168 (代先生),13538586433 (邓小姐)
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